Assignee
NONDHASITTHICHAI SOMCHAI
TH·10 granted patents·27 citations·filing 2007–2012
Top patents by PatentIndex Score
10 records- 0188US8648474B2Lead frame land grid arrayNONDHASITTHICHAI SOMCHAI·Filed 2012·Granted Feb 11, 2014·10 cites·13 claims
- 0280US9082607B1Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2007·Granted Jul 14, 2015·4 cites·16 claims
- 0375US9099317B2Method for forming lead frame land grid arrayNONDHASITTHICHAI SOMCHAI·Filed 2009·Granted Aug 4, 2015·4 cites·25 claims
- 0475US8575762B2Very extremely thin semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2007·Granted Nov 5, 2013·4 cites·20 claims
- 0567US9711343B1Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2007·Granted Jul 18, 2017·1 cites·21 claims
- 0666US8487451B2Lead frame land grid array with routing connector trace under unitNONDHASITTHICHAI SOMCHAI·Filed 2011·Granted Jul 16, 2013·2 cites·24 claims
- 0765US8492906B2Lead frame ball grid array with traces under dieNONDHASITTHICHAI SOMCHAI·Filed 2011·Granted Jul 23, 2013·2 cites·13 claims
- 0856US9099294B1Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2009·Granted Aug 4, 2015·0 cites·18 claims
- 0955US9196470B1Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2009·Granted Nov 24, 2015·0 cites·17 claims
- 1053US9899208B2Molded leadframe substrate semiconductor packageNONDHASITTHICHAI SOMCHAI·Filed 2010·Granted Feb 20, 2018·0 cites·5 claims
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