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NOVELLUS SYSTEMS INC
US770 patents
Top patents by PatentIndex Score
US9786570B2Oct 10, 2017
Methods for depositing films on sensitive substrates
NOVELLUS SYSTEMS INC362 citations99
US9390909B2Jul 12, 2016
Soft landing nanolaminates for advanced patterning
NOVELLUS SYSTEMS INC500 citations99
US7915139B1Mar 29, 2011
CVD flowable gap fill
NOVELLUS SYSTEMS INC807 citations99
US7888233B1Feb 15, 2011
Flowable film dielectric gap fill process
NOVELLUS SYSTEMS INC572 citations99
US7727880B1Jun 1, 2010
Protective self-aligned buffer layers for damascene interconnects
NOVELLUS SYSTEMS INC332 citations99
US7582555B1Sep 1, 2009
CVD flowable gap fill
NOVELLUS SYSTEMS INC605 citations99
US7524735B1Apr 28, 2009
Flowable film dielectric gap fill process
NOVELLUS SYSTEMS INC166 citations99
US7514375B1Apr 7, 2009
Pulsed bias having high pulse frequency for filling gaps with dielectric material
NOVELLUS SYSTEMS INC559 citations99
US7381644B1Jun 3, 2008
Pulsed PECVD method for modulating hydrogen content in hard mask
NOVELLUS SYSTEMS INC555 citations99
US7214630B1May 8, 2007
PMOS transistor with compressive dielectric capping layer
NOVELLUS SYSTEMS INC511 citations99
US7186648B1Mar 6, 2007
Barrier first method for single damascene trench applications
NOVELLUS SYSTEMS INC553 citations99
US7074690B1Jul 11, 2006
Selective gap-fill process
NOVELLUS SYSTEMS INC471 citations99
US6878402B2Apr 12, 2005
Method and apparatus for improved temperature control in atomic layer deposition
NOVELLUS SYSTEMS INC499 citations99
US6849122B1Feb 1, 2005
Thin layer metal chemical vapor deposition
NOVELLUS SYSTEMS INC115 citations99
US6846745B1Jan 25, 2005
High-density plasma process for filling high aspect ratio structures
NOVELLUS SYSTEMS INC311 citations99
US6764940B1Jul 20, 2004
Method for depositing a diffusion barrier for copper interconnect applications
NOVELLUS SYSTEMS INC139 citations99
US6713373B1Mar 30, 2004
Method for obtaining adhesion for device manufacture
NOVELLUS SYSTEMS INC168 citations99
US6635965B1Oct 21, 2003
Method for producing ultra-thin tungsten layers with improved step coverage
NOVELLUS SYSTEMS INC245 citations99
US6607977B1Aug 19, 2003
Method of depositing a diffusion barrier for copper interconnect applications
NOVELLUS SYSTEMS INC159 citations99
US6527920B1Mar 4, 2003
Copper electroplating apparatus
NOVELLUS SYSTEMS INC251 citations99
US6464779B1Oct 15, 2002
Copper atomic layer chemical vapor desposition
NOVELLUS SYSTEMS INC195 citations99
US6395150B1May 28, 2002
Very high aspect ratio gapfill using HDP
NOVELLUS SYSTEMS INC444 citations99
US6030881AFeb 29, 2000
High throughput chemical vapor deposition process capable of filling high aspect ratio structures
NOVELLUS SYSTEMS INC575 citations99
US6027631AFeb 22, 2000
Electroplating system with shields for varying thickness profile of deposited layer
NOVELLUS SYSTEMS INC318 citations99
US5984391ANov 16, 1999
Microfeature wafer handling apparatus and methods
NOVELLUS SYSTEMS INC506 citations99
US5872058AFeb 16, 1999
High aspect ratio gapfill process by using HDP
NOVELLUS SYSTEMS INC426 citations99
US5806980ASep 15, 1998
Methods and apparatus for measuring temperatures at high potential
NOVELLUS SYSTEMS INC503 citations99
US5405480AApr 11, 1995
Induction plasma source
NOVELLUS SYSTEMS INC162 citations99
US5238499AAug 24, 1993
Gas-based substrate protection during processing
NOVELLUS SYSTEMS INC411 citations99
US9653353B2May 16, 2017
Tungsten feature fill
NOVELLUS SYSTEMS INC50 citations98
US9472432B1Oct 18, 2016
Dedicated hot and cold end effectors for improved throughput
NOVELLUS SYSTEMS INC337 citations98
US9449795B2Sep 20, 2016
Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor
NOVELLUS SYSTEMS INC398 citations98
US9399228B2Jul 26, 2016
Method and apparatus for purging and plasma suppression in a process chamber
NOVELLUS SYSTEMS INC428 citations98
US9287113B2Mar 15, 2016
Methods for depositing films on sensitive substrates
NOVELLUS SYSTEMS INC74 citations98
US9240347B2Jan 19, 2016
Tungsten feature fill
NOVELLUS SYSTEMS INC72 citations98
US9234276B2Jan 12, 2016
Method to obtain SiC class of films of desired composition and film properties
NOVELLUS SYSTEMS INC42 citations98
US9236297B2Jan 12, 2016
Low tempature tungsten film deposition for small critical dimension contacts and interconnects
NOVELLUS SYSTEMS INC38 citations98
US8367546B2Feb 5, 2013
Methods for forming all tungsten contacts and lines
NOVELLUS SYSTEMS INC42 citations98
US8053365B2Nov 8, 2011
Methods for forming all tungsten contacts and lines
NOVELLUS SYSTEMS INC66 citations98
USD648289SNov 8, 2011
Electroplating flow shaping plate having offset spiral hole pattern
NOVELLUS SYSTEMS INC51 citations98
US8048805B2Nov 1, 2011
Methods for growing low-resistivity tungsten film
NOVELLUS SYSTEMS INC47 citations98
US8043972B1Oct 25, 2011
Adsorption based material removal process
NOVELLUS SYSTEMS INC537 citations98
US7981810B1Jul 19, 2011
Methods of depositing highly selective transparent ashable hardmask films
NOVELLUS SYSTEMS INC54 citations98
US7977249B1Jul 12, 2011
Methods for removing silicon nitride and other materials during fabrication of contacts
NOVELLUS SYSTEMS INC183 citations98
US7967969B2Jun 28, 2011
Method of electroplating using a high resistance ionic current source
NOVELLUS SYSTEMS INC50 citations98
US7935940B1May 3, 2011
Measuring in-situ UV intensity in UV cure tool
NOVELLUS SYSTEMS INC577 citations98
US7906174B1Mar 15, 2011
PECVD methods for producing ultra low-k dielectric films using UV treatment
NOVELLUS SYSTEMS INC507 citations98
US7897215B1Mar 1, 2011
Sequential UV induced chemical vapor deposition
NOVELLUS SYSTEMS INC524 citations98
US7888273B1Feb 15, 2011
Density gradient-free gap fill
NOVELLUS SYSTEMS INC45 citations98
US7851232B2Dec 14, 2010
UV treatment for carbon-containing low-k dielectric repair in semiconductor processing
NOVELLUS SYSTEMS INC571 citations98
Showing the top 50 of 770 patents by PatentIndex Score.