Assignee
NS ELECTRONICS BANGKOK 1993 LT
TH·5 granted patents·387 citations·filing 2003–2004
Technology mixH10W5
Top patents by PatentIndex Score
5 records- 0195US7060535B1Flat no-lead semiconductor die package including stud terminalsNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted Jun 13, 2006·179 cites·37 claims
- 0291US7205180B1Process of fabricating semiconductor packages using leadframes roughened with chemical etchantNS ELECTRONICS BANGKOK 1993 LT·Filed 2004·Granted Apr 17, 2007·60 cites·76 claims
- 0386US7049683B1Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compoundNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted May 23, 2006·40 cites·30 claims
- 0486US6943061B1Method of fabricating semiconductor chip package using screen printing of epoxy on waferNS ELECTRONICS BANGKOK 1993 LT·Filed 2004·Granted Sep 13, 2005·72 cites·17 claims
- 0580US7153724B1Method of fabricating no-lead package for semiconductor die with half-etched leadframeNS ELECTRONICS BANGKOK 1993 LT·Filed 2003·Granted Dec 26, 2006·36 cites·10 claims
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