Assignee
NUTOOL INC
US·46 granted patents·1 pending application·3,645 citations·filing 1998–2004
Top patents by PatentIndex Score
47 records- 0199US6497800B1Device providing electrical contact to the surface of a semiconductor workpiece during metal platingNUTOOL INC·Filed 2000·Granted Dec 24, 2002·144 cites·18 claims
- 0299US6413388B1Pad designs and structures for a versatile materials processing apparatusNUTOOL INC·Filed 2000·Granted Jul 2, 2002·191 cites·52 claims
- 0399US6176992B1Method and apparatus for electro-chemical mechanical depositionNUTOOL INC·Filed 1998·Granted Jan 23, 2001·664 cites·50 claims
- 0498US6413403B1Method and apparatus employing pad designs and structures with improved fluid distributionNUTOOL INC·Filed 2000·Granted Jul 2, 2002·93 cites·22 claims
- 0597US6867136B2Method for electrochemically processing a workpieceNUTOOL INC·Filed 2002·Granted Mar 15, 2005·141 cites·32 claims
- 0697US6610190B2Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrateNUTOOL INC·Filed 2001·Granted Aug 26, 2003·65 cites·42 claims
- 0797US6534116B2Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influenceNUTOOL INC·Filed 2000·Granted Mar 18, 2003·136 cites·30 claims
- 0897US6471847B2Method for forming an electrical contact with a semiconductor substrateNUTOOL INC·Filed 2001·Granted Oct 29, 2002·113 cites·16 claims
- 0997US6402925B2Method and apparatus for electrochemical mechanical depositionNUTOOL INC·Filed 2000·Granted Jun 11, 2002·134 cites·32 claims
- 1097US6355153B1Chip interconnect and packaging deposition methods and structuresNUTOOL INC·Filed 1999·Granted Mar 12, 2002·206 cites·11 claims
- 1196US6630059B1Workpeice proximity plating apparatusNUTOOL INC·Filed 2000·Granted Oct 7, 2003·92 cites·30 claims
- 1296US6482307B2Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishingNUTOOL INC·Filed 2000·Granted Nov 19, 2002·126 cites·28 claims
- 1396US6328872B1Method and apparatus for plating and polishing a semiconductor substrateNUTOOL INC·Filed 1999·Granted Dec 11, 2001·207 cites·50 claims
- 1495US6478936B1Anode assembly for plating and planarizing a conductive layerNUTOOL INC·Filed 2000·Granted Nov 12, 2002·46 cites·53 claims
- 1595US6409904B1Method and apparatus for depositing and controlling the texture of a thin filmNUTOOL INC·Filed 1999·Granted Jun 25, 2002·170 cites·30 claims
- 1695US6251235B1Apparatus for forming an electrical contact with a semiconductor substrateNUTOOL INC·Filed 1999·Granted Jun 26, 2001·138 cites·21 claims
- 1795US6207572B1Reverse linear chemical mechanical polisher with loadable housingNUTOOL INC·Filed 2000·Granted Mar 27, 2001·47 cites·20 claims
- 1895US6103628AReverse linear polisher with loadable housingNUTOOL INC·Filed 1998·Granted Aug 15, 2000·108 cites·18 claims
- 1994US6780772B2Method and system to provide electroplanarization of a workpiece with a conducting material layerNUTOOL INC·Filed 2001·Granted Aug 24, 2004·73 cites·16 claims
- 2094US6352623B1Vertically configured chamber used for multiple processesNUTOOL INC·Filed 1999·Granted Mar 5, 2002·131 cites·66 claims
- 2193US6676822B1Method for electro chemical mechanical depositionNUTOOL INC·Filed 2000·Granted Jan 13, 2004·53 cites·31 claims
- 2293US6666959B2Semiconductor workpiece proximity plating methods and apparatusNUTOOL INC·Filed 2001·Granted Dec 23, 2003·50 cites·11 claims
- 2392US6908374B2Chemical mechanical polishing endpoint detectionNUTOOL INC·Filed 2002·Granted Jun 21, 2005·43 cites·29 claims
- 2491US6612915B1Work piece carrier head for plating and polishingNUTOOL INC·Filed 1999·Granted Sep 2, 2003·74 cites·20 claims
- 2590US6833063B2Electrochemical edge and bevel cleaning process and systemNUTOOL INC·Filed 2001·Granted Dec 21, 2004·50 cites·43 claims
- 2688US6722946B2Advanced chemical mechanical polishing system with smart endpoint detectionNUTOOL INC·Filed 2002·Granted Apr 20, 2004·26 cites·19 claims
- 2787US6582579B1Methods for repairing defects on a semiconductor substrateNUTOOL INC·Filed 2000·Granted Jun 24, 2003·34 cites·25 claims
- 2886US6858121B2Method and apparatus for filling low aspect ratio cavities with conductive material at high rateNUTOOL INC·Filed 2001·Granted Feb 22, 2005·35 cites·59 claims
- 2985US6468139B1Polishing apparatus and method with a refreshing polishing belt and loadable housingNUTOOL INC·Filed 2000·Granted Oct 22, 2002·26 cites·63 claims
- 3083US6464571B2Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided thereinNUTOOL INC·Filed 2001·Granted Oct 15, 2002·19 cites·51 claims
- 3182US6802946B2Apparatus for controlling thickness uniformity of electroplated and electroetched layersNUTOOL INC·Filed 2001·Granted Oct 12, 2004·26 cites·54 claims
- 3280US6852208B2Method and apparatus for full surface electrotreating of a waferNUTOOL INC·Filed 2002·Granted Feb 8, 2005·20 cites·16 claims
- 3380US6797132B2Apparatus for plating and polishing a semiconductor workpieceNUTOOL INC·Filed 2001·Granted Sep 28, 2004·17 cites·12 claims
- 3478US6716084B2Carrier head for holding a wafer and allowing processing on a front face thereof to occurNUTOOL INC·Filed 2002·Granted Apr 6, 2004·20 cites·8 claims
- 3574US6815354B2Method and structure for thru-mask contact electrodepositionNUTOOL INC·Filed 2002·Granted Nov 9, 2004·20 cites·19 claims
- 3674US6579800B2Chemical mechanical polishing endpoint detectionNUTOOL INC·Filed 2001·Granted Jun 17, 2003·13 cites·15 claims
- 3771US6773576B2Anode assembly for plating and planarizing a conductive layerNUTOOL INC·Filed 2002·Granted Aug 10, 2004·5 cites·19 claims
- 3869US6695962B2Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designsNUTOOL INC·Filed 2001·Granted Feb 24, 2004·10 cites·32 claims
- 3969US6649523B2Method and system to provide material removal and planarization employing a reactive padNUTOOL INC·Filed 2001·Granted Nov 18, 2003·10 cites·20 claims
- 4066US6604988B2Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided thereinNUTOOL INC·Filed 2002·Granted Aug 12, 2003·8 cites·27 claims
- 4164US6589105B2Pad tensioning method and system in a bi-directional linear polisherNUTOOL INC·Filed 2002·Granted Jul 8, 2003·10 cites·21 claims
- 4263US6777338B2Edge and bevel cleaning process and systemNUTOOL INC·Filed 2002·Granted Aug 17, 2004·7 cites·31 claims
- 4363US6736929B2Distributed control system for semiconductor manufacturing equipmentNUTOOL INC·Filed 2002·Granted May 18, 2004·13 cites·8 claims
- 4460US6634935B2Single drive system for a bi-directional linear chemical mechanical polishing apparatusNUTOOL INC·Filed 2002·Granted Oct 21, 2003·8 cites·25 claims
- 4559US6692588B1Method and apparatus for simultaneously cleaning and annealing a workpieceNUTOOL INC·Filed 1999·Granted Feb 17, 2004·21 cites·73 claims
- 4650US6932896B2Method and apparatus for avoiding particle accumulation in electrodepositionNUTOOL INC·Filed 2001·Granted Aug 23, 2005·2 cites·44 claims
- 4743US2004163963A1Method of supplying solution for electrochemical processes from double-cavity electrode housingNUTOOL INC·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when NUTOOL INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →