Assignee

OBARA TAICHI

JP·2 granted patents·11 citations·filing 2011–2013

Technology mixH10W2 H01L1 H05K1 Y10T1

Top patents by PatentIndex Score

2 records

0185US8093692B2Semiconductor device packaging including a power semiconductor elementOBARA TAICHI·Filed 2011·Granted Jan 10, 2012·11 cites·3 claims
0242US9125308B2Semiconductor device and method of manufacturing thereofOBARA TAICHI·Filed 2013·Granted Sep 1, 2015·0 cites·9 claims

Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →