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OGANESIAN VAGE
US34 patents
Top patents by PatentIndex Score
US8847376B2Sep 30, 2014
Microelectronic elements with post-assembly planarization
OGANESIAN VAGE49 citations98
US8791575B2Jul 29, 2014
Microelectronic elements having metallic pads overlying vias
OGANESIAN VAGE87 citations98
US8598695B2Dec 3, 2013
Active chip on carrier or laminated chip having microelectronic element embedded therein
OGANESIAN VAGE39 citations98
US8796135B2Aug 5, 2014
Microelectronic elements with rear contacts connected with via first or via middle structures
OGANESIAN VAGE45 citations94
US8736066B2May 27, 2014
Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
OGANESIAN VAGE17 citations93
US8610259B2Dec 17, 2013
Multi-function and shielded 3D interconnects
OGANESIAN VAGE15 citations93
US8604576B2Dec 10, 2013
Low stress cavity package for back side illuminated image sensor, and method of making same
OGANESIAN VAGE16 citations93
US8502340B2Aug 6, 2013
High density three-dimensional integrated capacitors
OGANESIAN VAGE15 citations93
US8432011B1Apr 30, 2013
Wire bond interposer package for CMOS image sensor and method of making same
OGANESIAN VAGE27 citations93
US9233511B2Jan 12, 2016
Method of making stamped multi-layer polymer lens
OGANESIAN VAGE7 citations84
US9099479B2Aug 4, 2015
Carrier structures for microelectronic elements
OGANESIAN VAGE4 citations84
US9018725B2Apr 28, 2015
Stepped package for image sensor and method of making same
OGANESIAN VAGE9 citations84
US8847380B2Sep 30, 2014
Staged via formation from both sides of chip
OGANESIAN VAGE10 citations84
US8796800B2Aug 5, 2014
Interposer package for CMOS image sensor and method of making same
OGANESIAN VAGE11 citations84
US8759930B2Jun 24, 2014
Low profile image sensor package
OGANESIAN VAGE9 citations84
US8697569B2Apr 15, 2014
Non-lithographic formation of three-dimensional conductive elements
OGANESIAN VAGE5 citations84
US8692344B2Apr 8, 2014
Back side illuminated image sensor architecture, and method of making same
OGANESIAN VAGE16 citations84
US8685793B2Apr 1, 2014
Chip assembly having via interconnects joined by plating
OGANESIAN VAGE6 citations84
US8610264B2Dec 17, 2013
Compliant interconnects in wafers
OGANESIAN VAGE5 citations84
US8570669B2Oct 29, 2013
Multi-layer polymer lens and method of making same
OGANESIAN VAGE8 citations84
US8552518B2Oct 8, 2013
3D integrated microelectronic assembly with stress reducing interconnects
OGANESIAN VAGE10 citations84
US8546951B2Oct 1, 2013
3D integration microelectronic assembly for integrated circuit devices
OGANESIAN VAGE7 citations84
US8546900B2Oct 1, 2013
3D integration microelectronic assembly for integrated circuit devices
OGANESIAN VAGE12 citations84
US8486758B2Jul 16, 2013
Simultaneous wafer bonding and interconnect joining
OGANESIAN VAGE14 citations84
US9041133B2May 26, 2015
BSI image sensor package with embedded absorber for even reception of different wavelengths
OGANESIAN VAGE4 citations73
US8921759B2Dec 30, 2014
Integrated image sensor package with liquid crystal lens
OGANESIAN VAGE6 citations73
US8937361B2Jan 20, 2015
BSI image sensor package with variable-height silicon for even reception of different wavelengths
OGANESIAN VAGE3 citations63
US8587126B2Nov 19, 2013
Stacked microelectronic assembly with TSVs formed in stages with plural active chips
OGANESIAN VAGE4 citations63
US8115308B2Feb 14, 2012
Microelectronic assemblies having compliancy and methods therefor
OGANESIAN VAGE2 citations63
US8841763B2Sep 23, 2014
Three-dimensional system-in-a-package
OGANESIAN VAGE1 citations52
US8759973B2Jun 24, 2014
Microelectronic assemblies having compliancy and methods therefor
OGANESIAN VAGE0 citations52
US8512491B2Aug 20, 2013
Dual wafer spin coating
OGANESIAN VAGE1 citations52
US9640437B2May 2, 2017
Methods of forming semiconductor elements using micro-abrasive particle stream
OGANESIAN VAGE0 citations42
US8686565B2Apr 1, 2014
Stacked chip assembly having vertical vias
OGANESIAN VAGE0 citations42