Assignee
OGASHIWA TOSHINORI
JP6 patents
Top patents by PatentIndex Score
US8505804B2Aug 13, 2013
Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
OGASHIWA TOSHINORI8 citations82
US8962471B2Feb 24, 2015
Bump, method for forming the bump, and method for mounting substrate having the bump thereon
OGASHIWA TOSHINORI0 citations50
US8558433B2Oct 15, 2013
Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
OGASHIWA TOSHINORI0 citations50
US8492894B2Jul 23, 2013
Bump, method for forming the bump, and method for mounting substrate having the bump thereon
OGASHIWA TOSHINORI0 citations50
US9065418B2Jun 23, 2015
Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same material
OGASHIWA TOSHINORI0 citations46
US8912088B2Dec 16, 2014
Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
OGASHIWA TOSHINORI0 citations36