Assignee
OGAWA TAIJI
JP·1 granted patent·1 pending application·4 citations·filing 2012–2012
Top patents by PatentIndex Score
2 records- 0166US8841976B2Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationshipOGAWA TAIJI·Filed 2012·Granted Sep 23, 2014·4 cites·8 claims
- 0234US2012175158A1Circuit boardOGAWA TAIJI·Filed 2012·Application pending·0 cites
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