Assignee
OGIHARA CHIHO
JP·2 granted patents·4 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0166US8519529B2Semiconductor package with lid bonded on wiring board and method of manufacturing the sameOGIHARA CHIHO·Filed 2011·Granted Aug 27, 2013·4 cites·19 claims
- 0242US8309859B2Method of manufacturing a substrate, substrate, device provided with a substrate, and determining methodOGIHARA CHIHO·Filed 2009·Granted Nov 13, 2012·0 cites·13 claims
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