Assignee
OGURA ICHIROU
JP4 patents
Top patents by PatentIndex Score
US8084567B2Dec 27, 2011
Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
OGURA ICHIROU3 citations60
US8440781B2May 14, 2013
Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resin
OGURA ICHIROU0 citations50
US8420749B2Apr 16, 2013
Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resin
OGURA ICHIROU0 citations50
US8703845B2Apr 22, 2014
Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
OGURA ICHIROU0 citations34