Assignee
OHASHI NAOMICHI
JP·3 granted patents·15 citations·filing 2009–2013
Top patents by PatentIndex Score
3 records- 0184US9331047B2Mounting method and mounting structure for semiconductor package componentOHASHI NAOMICHI·Filed 2013·Granted May 3, 2016·9 cites·3 claims
- 0270US8450859B2Semiconductor device mounted structure and its manufacturing methodOHASHI NAOMICHI·Filed 2009·Granted May 28, 2013·5 cites·12 claims
- 0357US8182923B2Conductive paste and mounting structure using the sameOHASHI NAOMICHI·Filed 2009·Granted May 22, 2012·1 cites·17 claims
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