Assignee

OHBAYASHI TAKASHI

JP·1 granted patent·20 citations·filing 2012–2012

Technology mixC04B1 C09K1 H01L1 H10H1 H10W1

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0189US8791485B2LED encapsulation resin body, LED device, and method for manufacturing LED deviceOHBAYASHI TAKASHI·Filed 2012·Granted Jul 29, 2014·20 cites·5 claims

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