Assignee
OHHIRA RISATO
JP·3 granted patents·3 pending applications·5 citations·filing 2007–2011
Top patents by PatentIndex Score
6 records- 0162US8604891B2High frequency substrate including a signal line breaking portion coupled by a capacitorOHHIRA RISATO·Filed 2009·Granted Dec 10, 2013·3 cites·7 claims
- 0255US8154364B2High-frequency transmission line having ground surface patterns with a plurality of notches thereinOHHIRA RISATO·Filed 2007·Granted Apr 10, 2012·2 cites·8 claims
- 0348US2011226518A1Substrate of circuit module and manufacturing method thereforOHHIRA RISATO·Filed 2009·Application pending·0 cites
- 0443US9019035B2High frequency wiring board comprised of interconnected first and second coplanar lines on different layers and having a ground pattern physically separated therefromOHHIRA RISATO·Filed 2008·Granted Apr 28, 2015·0 cites·12 claims
- 0542US2010254094A1High-Frequency Wiring Board and High-Frequency Module That Uses the High-Frequency Wiring BoardOHHIRA RISATO·Filed 2008·Application pending·0 cites
- 0633US2012326812A1High-frequency transmission line and circuit substrateOHHIRA RISATO·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when OHHIRA RISATO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →