Assignee
OHIGASHI NORIYUKI
JP·2 granted patents·2 pending applications·8 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0174US8318292B2Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2009·Granted Nov 27, 2012·5 cites·15 claims
- 0273US8969490B2Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2009·Granted Mar 3, 2015·3 cites·20 claims
- 0335US2012111621A1Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2010·Application pending·0 cites
- 0427US2013105200A1Prepreg, wiring board, and semiconductor deviceOHIGASHI NORIYUKI·Filed 2011·Application pending·0 cites
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