Assignee
OISHI HIROSHI
JP·4 granted patents·16 citations·filing 2007–2010
Top patents by PatentIndex Score
4 records- 0178US8567384B2Slicing method and wire saw apparatusOISHI HIROSHI·Filed 2008·Granted Oct 29, 2013·8 cites·3 claims
- 0273US8148753B2Compound semiconductor substrate having multiple buffer layersOISHI HIROSHI·Filed 2010·Granted Apr 3, 2012·3 cites·3 claims
- 0371US8167681B2Slicing methodOISHI HIROSHI·Filed 2007·Granted May 1, 2012·4 cites·4 claims
- 0459US8210906B2Slicing method and method for manufacturing epitaxial waferOISHI HIROSHI·Filed 2007·Granted Jul 3, 2012·1 cites·12 claims
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