Assignee
OKA SEIJI
JP·10 granted patents·1 pending application·67 citations·filing 2008–2013
Top patents by PatentIndex Score
11 records- 0191US8502385B2Power semiconductor deviceOKA SEIJI·Filed 2011·Granted Aug 6, 2013·14 cites·10 claims
- 0288US8436459B2Power semiconductor moduleOKA SEIJI·Filed 2009·Granted May 7, 2013·18 cites·7 claims
- 0383US8304882B2Power semiconductor deviceOKA SEIJI·Filed 2010·Granted Nov 6, 2012·6 cites·15 claims
- 0481US8575745B2Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring boardOKA SEIJI·Filed 2011·Granted Nov 5, 2013·5 cites·8 claims
- 0581US8299601B2Power semiconductor module and manufacturing method thereofOKA SEIJI·Filed 2009·Granted Oct 30, 2012·10 cites·3 claims
- 0675US8741695B2Semiconductor device and method of manufacturing the sameOKA SEIJI·Filed 2012·Granted Jun 3, 2014·3 cites·5 claims
- 0774US8319333B2Power semiconductor moduleOKA SEIJI·Filed 2009·Granted Nov 27, 2012·6 cites·9 claims
- 0868US8299603B2Power semiconductor deviceOKA SEIJI·Filed 2008·Granted Oct 30, 2012·4 cites·12 claims
- 0958US8610261B2Power semiconductor deviceOKA SEIJI·Filed 2009·Granted Dec 17, 2013·1 cites·8 claims
- 1049US8313986B2Method of manufacturing power semiconductor deviceOKA SEIJI·Filed 2012·Granted Nov 20, 2012·0 cites·22 claims
- 1143US2014035123A1Semiconductor device and method for manufacturing semiconductor deviceOKA SEIJI·Filed 2013·Application pending·0 cites
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