Assignee
OKUDO TAKAFUMI
JP·2 granted patents·25 citations·filing 2006–2006
Top patents by PatentIndex Score
2 records- 0186US8080869B2Wafer level package structure and production method thereforOKUDO TAKAFUMI·Filed 2006·Granted Dec 20, 2011·21 cites·13 claims
- 0267US8067769B2Wafer level package structure, and sensor device obtained from the same package structureOKUDO TAKAFUMI·Filed 2006·Granted Nov 29, 2011·4 cites·22 claims
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