Assignee

OKUNO CHOUHEI

JP·1 granted patent·1 pending application·0 citations·filing 2009–2011

Technology mixH10P2 Y10T2 H10W1

Top patents by PatentIndex Score

2 records

0139US2010038009A1Method and apparatus for joining protective tape to semiconductor waferOKUNO CHOUHEI·Filed 2009·Application pending·0 cites
0231US8679289B2Method and apparatus for separating protective tapeOKUNO CHOUHEI·Filed 2011·Granted Mar 25, 2014·0 cites·10 claims

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