Assignee
OKUNO TOSHIAKI
JP·1 granted patent·1 pending application·6 citations·filing 2007–2011
Top patents by PatentIndex Score
2 records- 0177US8975736B2Wafer level package, chip size package device and method of manufacturing wafer level packageOKUNO TOSHIAKI·Filed 2011·Granted Mar 10, 2015·6 cites·20 claims
- 0240US2009185161A1Optical Measurement Apparatus And Wideband Light Source Apparatus Employable ThereinOKUNO TOSHIAKI·Filed 2007·Application pending·0 cites
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