Assignee
ONG YOU YANG
MY·7 granted patents·41 citations·filing 2005–2012
Top patents by PatentIndex Score
7 records- 0179US8163604B2Integrated circuit package system using etched leadframeONG YOU YANG·Filed 2005·Granted Apr 24, 2012·15 cites·20 claims
- 0277US8546929B2Embedded integrated circuit package-on-package systemONG YOU YANG·Filed 2006·Granted Oct 1, 2013·8 cites·20 claims
- 0374US8164182B2Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chipONG YOU YANG·Filed 2005·Granted Apr 24, 2012·9 cites·10 claims
- 0473US8803299B2Stacked integrated circuit package systemONG YOU YANG·Filed 2006·Granted Aug 12, 2014·6 cites·20 claims
- 0564US8093694B2Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structuresONG YOU YANG·Filed 2005·Granted Jan 10, 2012·3 cites·20 claims
- 0649US8067832B2Embedded integrated circuit package system and method of manufacture thereofONG YOU YANG·Filed 2010·Granted Nov 29, 2011·0 cites·17 claims
- 0744US8415786B2Thermally enhanced semiconductor package systemONG YOU YANG·Filed 2012·Granted Apr 9, 2013·0 cites·5 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →