Assignee

OOYAMA KOOKI

JP2 patents

Top patents by PatentIndex Score

US8226398B2Jul 24, 2012

Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheet

OOYAMA KOOKI0 citations41

US8092204B2Jan 10, 2012

Apparatus and method for inflation extrusion molding of pressure-sensitive adhesive sheet

OOYAMA KOOKI0 citations41