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OPTIZ INC
US30 patents
Top patents by PatentIndex Score
US9996725B2Jun 12, 2018
Under screen sensor assembly
OPTIZ INC4 citations73
US9214592B2Dec 15, 2015
Method of making interposer package for CMOS image sensor
OPTIZ INC4 citations73
US10139619B2Nov 27, 2018
Back side illumination image sensor with non-planar optical interface
OPTIZ INC2 citations72
US9985063B2May 29, 2018
Imaging device with photo detectors and color filters arranged by color transmission characteristics and absorption coefficients
OPTIZ INC4 citations72
US9853079B2Dec 26, 2017
Method of forming a stress released image sensor package structure
OPTIZ INC4 citations72
US9666730B2May 30, 2017
Wire bond sensor package
OPTIZ INC5 citations72
US9543347B2Jan 10, 2017
Stress released image sensor package structure and method
OPTIZ INC3 citations72
US9496247B2Nov 15, 2016
Integrated camera module and method of making same
OPTIZ INC4 citations72
US11408589B2Aug 9, 2022
Monolithic multi-focus light source device
OPTIZ INC0 citations63
US9524917B2Dec 20, 2016
Chip level heat dissipation using silicon
OPTIZ INC2 citations63
US9893218B2Feb 13, 2018
Sensor package with cooling feature
OPTIZ INC1 citations62
US9219091B2Dec 22, 2015
Low profile sensor module and method of making same
OPTIZ INC2 citations62
US9373660B2Jun 21, 2016
Method of forming a low profile image sensor package with an image sensor substrate, a support substrate and a printed circuit board
OPTIZ INC0 citations52
US9373653B2Jun 21, 2016
Stepped package for image sensor
OPTIZ INC1 citations52
US9230947B2Jan 5, 2016
Method of forming 3D integrated microelectronic assembly with stress reducing interconnects
OPTIZ INC0 citations52
US9196650B2Nov 24, 2015
Method of forming a low profile image sensor package
OPTIZ INC0 citations52
US9054013B2Jun 9, 2015
Method of making 3D integration microelectronic assembly for integrated circuit devices
OPTIZ INC0 citations52
US8895344B2Nov 25, 2014
Method of making a low stress cavity package for back side illuminated image sensor
OPTIZ INC0 citations52
US8753925B2Jun 17, 2014
Method of making 3D integration microelectronic assembly for integrated circuit devices
OPTIZ INC0 citations52
US10199519B2Feb 5, 2019
Method of making a sensor package with cooling feature
OPTIZ INC0 citations51
US9972730B2May 15, 2018
Method of making a sensor package with cooling feature
OPTIZ INC0 citations51
US9893213B2Feb 13, 2018
Method of forming a wire bond sensor package
OPTIZ INC1 citations51
US9667900B2May 30, 2017
Three dimensional system-on-chip image sensor package
OPTIZ INC1 citations51
US9666625B2May 30, 2017
Method of making low profile sensor package with cooling feature
OPTIZ INC0 citations51
US9570634B2Feb 14, 2017
Sensor package with exposed sensor array and method of making same
OPTIZ INC1 citations51
US9496297B2Nov 15, 2016
Sensor package with cooling feature and method of making same
OPTIZ INC0 citations51
US9461190B2Oct 4, 2016
Low profile sensor package with cooling feature and method of making same
OPTIZ INC0 citations51
US9142695B2Sep 22, 2015
Sensor package with exposed sensor array and method of making same
OPTIZ INC1 citations51
US11614361B1Mar 28, 2023
Hyperspectral camera
OPTIZ INC0 citations42
US9190443B2Nov 17, 2015
Low profile image sensor
OPTIZ INC0 citations41