Assignee
ORIENT SEMICONDUCTOR ELECT LTD
TW·21 granted patents·4 pending applications·157 citations·filing 1997–2010
Top patents by PatentIndex Score
25 records- 0187US7948772B2Memory card with electrostatic discharge protection and manufacturing method thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2009·Granted May 24, 2011·34 cites·19 claims
- 0271USD647097SMemory cardORIENT SEMICONDUCTOR ELECT LTD·Filed 2010·Granted Oct 18, 2011·21 cites·1 claims
- 0367US7576418B2Lead frame structure and applications thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2008·Granted Aug 18, 2009·6 cites·14 claims
- 0462USD647096SMemory cardORIENT SEMICONDUCTOR ELECT LTD·Filed 2010·Granted Oct 18, 2011·14 cites·1 claims
- 0562US7115978B2Package StructureORIENT SEMICONDUCTOR ELECT LTD·Filed 2004·Granted Oct 3, 2006·12 cites·6 claims
- 0659US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 0755US6677185B2Method of affixing a heat sink to a substrate and package thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2002·Granted Jan 13, 2004·13 cites·4 claims
- 0854US7394147B2Semiconductor packageORIENT SEMICONDUCTOR ELECT LTD·Filed 2005·Granted Jul 1, 2008·1 cites·13 claims
- 0952US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 1051US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 1151US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 1250US6847111B2Semiconductor device with heat-dissipating capabilityORIENT SEMICONDUCTOR ELECT LTD·Filed 2003·Granted Jan 25, 2005·8 cites·5 claims
- 1349US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 1447US2009189295A1Stack chip package structure and manufacturing method thereofORIENT SEMICONDUCTOR ELECT LTD·Filed 2008·Application pending·0 cites
- 1541US2008304245A1Semiconductor package and method for discharging electronic devices on a substrateORIENT SEMICONDUCTOR ELECT LTD·Filed 2007·Application pending·0 cites
- 1639US2007205493A1Semiconductor package structure and method for manufacturing the sameORIENT SEMICONDUCTOR ELECT LTD·Filed 2006·Application pending·0 cites
- 1739US2008007932A1Memory card with electrostatic discharge protectionORIENT SEMICONDUCTOR ELECT LTD·Filed 2006·Application pending·0 cites
- 1836US6608391B1Preparation method of underfill for flip chip package and the deviceORIENT SEMICONDUCTOR ELECT LTD·Filed 2002·Granted Aug 19, 2003·5 cites·2 claims
- 1936US6577151B1Inspection device for wiring of an integrated circuitORIENT SEMICONDUCTOR ELECT LTD·Filed 2002·Granted Jun 10, 2003·2 cites·1 claims
- 2030US6600216B1Structure of a pin platform for integrated circuitORIENT SEMICONDUCTOR ELECT LTD·Filed 2002·Granted Jul 29, 2003·0 cites·1 claims
- 2126US6521484B1Mold injection method for semiconductor deviceORIENT SEMICONDUCTOR ELECT LTD·Filed 1999·Granted Feb 18, 2003·2 cites·2 claims
- 2224US6260611B1Heat dissipation moduleORIENT SEMICONDUCTOR ELECT LTD·Filed 1999·Granted Jul 17, 2001·4 cites·1 claims
- 2324US6033934ASemiconductor chip fabrication method and apparatus thereforORIENT SEMICONDUCTOR ELECT LTD·Filed 1997·Granted Mar 7, 2000·1 cites·2 claims
- 2424US5821607AFrame for manufacturing encapsulated semiconductor devicesORIENT SEMICONDUCTOR ELECT LTD·Filed 1997·Granted Oct 13, 1998·0 cites·1 claims
- 2522US6274883B1Structure of a ball grid array substrate with charts for indicating position of defective chipsORIENT SEMICONDUCTOR ELECT LTD·Filed 1999·Granted Aug 14, 2001·2 cites·1 claims
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