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ORTHODYNE ELECTRONICS CORP
US23 patents
Top patents by PatentIndex Score
US4976392ADec 11, 1990
Ultrasonic wire bonder wire formation and cutter system
ORTHODYNE ELECTRONICS CORP104 citations94
US7745253B2Jun 29, 2010
Ribbon bonding in an electronic package
ORTHODYNE ELECTRONICS CORP27 citations91
US4438880AMar 27, 1984
Ultrasonic wire bond touchdown sensor
ORTHODYNE ELECTRONICS CORP30 citations90
US4824005AApr 25, 1989
Dual mode ultrasonic generator in a wire bonding apparatus
ORTHODYNE ELECTRONICS CORP42 citations88
US5894981AApr 20, 1999
Integrated pull tester with an ultrasonic wire bonder
ORTHODYNE ELECTRONICS CORP71 citations86
US6439448B1Aug 27, 2002
Large wire bonder head
ORTHODYNE ELECTRONICS CORP59 citations85
US5868300AFeb 9, 1999
Articulated wire bonder
ORTHODYNE ELECTRONICS CORP20 citations85
US6471116B2Oct 29, 2002
Wire bonding spool system
ORTHODYNE ELECTRONICS CORP15 citations82
US7909228B2Mar 22, 2011
Ribbon bonding tool and process
ORTHODYNE ELECTRONICS CORP8 citations80
US9929122B2Mar 27, 2018
Ribbon bonding tools and methods of using the same
ORTHODYNE ELECTRONICS CORP11 citations77
US7407079B2Aug 5, 2008
Automated filament attachment system for vacuum fluorescent display
ORTHODYNE ELECTRONICS CORP13 citations77
US9981336B2May 29, 2018
Ribbon bonding tools, and methods of designing ribbon bonding tools
ORTHODYNE ELECTRONICS CORP7 citations76
US8746537B2Jun 10, 2014
Ultrasonic bonding systems and methods of using the same
ORTHODYNE ELECTRONICS CORP2 citations61
US7934633B2May 3, 2011
Ribbon bonding tool and process
ORTHODYNE ELECTRONICS CORP2 citations59
US10092984B2Oct 9, 2018
Methods and systems for aligning tooling elements of ultrasonic bonding systems
ORTHODYNE ELECTRONICS CORP1 citations56
US9925624B2Mar 27, 2018
Methods and systems for aligning tooling elements of ultrasonic bonding systems
ORTHODYNE ELECTRONICS CORP1 citations56
US9931709B2Apr 3, 2018
Wedge bonding tools, wedge bonding systems, and related methods
ORTHODYNE ELECTRONICS CORP0 citations51
US8584922B1Nov 19, 2013
Ultrasonic bonding systems and methods of using the same
ORTHODYNE ELECTRONICS CORP0 citations51
US8573468B1Nov 5, 2013
Ultrasonic bonding systems and methods of using the same
ORTHODYNE ELECTRONICS CORP1 citations51
US7537149B2May 26, 2009
Deep access large ribbon bond head
ORTHODYNE ELECTRONICS CORP0 citations51
US8998063B2Apr 7, 2015
Wire loop forming systems and methods of using the same
ORTHODYNE ELECTRONICS CORP0 citations48
US9527189B2Dec 27, 2016
Systems and methods for processing solar substrates
ORTHODYNE ELECTRONICS CORP0 citations46
US7222737B2May 29, 2007
Die sorter with reduced mean time to convert
ORTHODYNE ELECTRONICS CORP3 citations45