Assignee
OSADA MICHIO
JP3 patents
Top patents by PatentIndex Score
US4862586ASep 5, 1989
Lead frame for enclosing semiconductor chips with resin
OSADA MICHIO31 citations92
US4793785ADec 27, 1988
Apparatus of multiplunger type for enclosing semiconductor elements with resin
OSADA MICHIO55 citations92
US4723899AFeb 9, 1988
Molding apparatus for enclosing semiconductor chips with resin
OSADA MICHIO33 citations92