Individual holder
PAGAILA REZA A
SG·74 granted patents·3 pending applications·1,779 citations·filing 2008–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
77 records- 0199US8518746B2Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor diePAGAILA REZA A·Filed 2010·Granted Aug 27, 2013·98 cites·20 claims
- 0299US8097490B1Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 17, 2012·155 cites·20 claims
- 0399US8080445B1Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposersPAGAILA REZA A·Filed 2010·Granted Dec 20, 2011·94 cites·12 claims
- 0498US9508626B2Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package heightPAGAILA REZA A·Filed 2010·Granted Nov 29, 2016·50 cites·26 claims
- 0598US9406619B2Semiconductor device including pre-fabricated shielding frame disposed over semiconductor diePAGAILA REZA A·Filed 2012·Granted Aug 2, 2016·46 cites·24 claims
- 0698US9054095B2Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposersPAGAILA REZA A·Filed 2011·Granted Jun 9, 2015·50 cites·32 claims
- 0798US8940636B2Through hole vias at saw streets including protrusions or recesses for interconnectionPAGAILA REZA A·Filed 2011·Granted Jan 27, 2015·39 cites·21 claims
- 0898US8796137B2Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnectPAGAILA REZA A·Filed 2010·Granted Aug 5, 2014·47 cites·26 claims
- 0998US8742579B2Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2012·Granted Jun 3, 2014·101 cites·25 claims
- 1098US8288201B2Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor diePAGAILA REZA A·Filed 2010·Granted Oct 16, 2012·63 cites·25 claims
- 1198US8283205B2Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor diePAGAILA REZA A·Filed 2012·Granted Oct 9, 2012·47 cites·19 claims
- 1298US8268677B1Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposerPAGAILA REZA A·Filed 2011·Granted Sep 18, 2012·36 cites·31 claims
- 1398US8263434B2Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoPPAGAILA REZA A·Filed 2009·Granted Sep 11, 2012·110 cites·20 claims
- 1498US8193034B2Semiconductor device and method of forming vertical interconnect structure using stud bumpsPAGAILA REZA A·Filed 2009·Granted Jun 5, 2012·72 cites·20 claims
- 1598US8133762B2Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2009·Granted Mar 13, 2012·84 cites·22 claims
- 1697US9324672B2Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale packagePAGAILA REZA A·Filed 2009·Granted Apr 26, 2016·63 cites·20 claims
- 1797US8822281B2Semiconductor device and method of forming TMV and TSV in WLCSP using same carrierPAGAILA REZA A·Filed 2010·Granted Sep 2, 2014·32 cites·25 claims
- 1897US8492201B2Semiconductor device and method of forming through vias with reflowed conductive materialPAGAILA REZA A·Filed 2010·Granted Jul 23, 2013·29 cites·32 claims
- 1997US8435835B2Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor diePAGAILA REZA A·Filed 2010·Granted May 7, 2013·33 cites·16 claims
- 2097US8258012B2Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor diePAGAILA REZA A·Filed 2010·Granted Sep 4, 2012·25 cites·25 claims
- 2197US8105872B2Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 31, 2012·25 cites·20 claims
- 2296US8258010B2Making a semiconductor device having conductive through organic viasPAGAILA REZA A·Filed 2009·Granted Sep 4, 2012·41 cites·29 claims
- 2396US8101460B2Semiconductor device and method of shielding semiconductor die from inter-device interferencePAGAILA REZA A·Filed 2008·Granted Jan 24, 2012·44 cites·25 claims
- 2496US8097489B2Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor diePAGAILA REZA A·Filed 2009·Granted Jan 17, 2012·36 cites·20 claims
- 2595US9875911B2Semiconductor device and method of forming interposer with opening to contain semiconductor diePAGAILA REZA A·Filed 2010·Granted Jan 23, 2018·19 cites·11 claims
- 2695US9337116B2Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor diePAGAILA REZA A·Filed 2010·Granted May 10, 2016·20 cites·38 claims
- 2795US8810011B2Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposerPAGAILA REZA A·Filed 2012·Granted Aug 19, 2014·16 cites·25 claims
- 2895US8466544B2Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSPPAGAILA REZA A·Filed 2011·Granted Jun 18, 2013·19 cites·23 claims
- 2995US8169058B2Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillarsPAGAILA REZA A·Filed 2009·Granted May 1, 2012·29 cites·30 claims
- 3093US8236617B2Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structurePAGAILA REZA A·Filed 2010·Granted Aug 7, 2012·14 cites·25 claims
- 3192US8304277B2Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump lockingPAGAILA REZA A·Filed 2010·Granted Nov 6, 2012·12 cites·20 claims
- 3292US8076757B2Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interferencePAGAILA REZA A·Filed 2010·Granted Dec 13, 2011·13 cites·25 claims
- 3391US8866294B2Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulationPAGAILA REZA A·Filed 2012·Granted Oct 21, 2014·10 cites·24 claims
- 3491US8501544B2Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulationPAGAILA REZA A·Filed 2011·Granted Aug 6, 2013·12 cites·24 claims
- 3591US8492196B2Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor diePAGAILA REZA A·Filed 2012·Granted Jul 23, 2013·9 cites·20 claims
- 3691US8237252B2Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipationPAGAILA REZA A·Filed 2009·Granted Aug 7, 2012·14 cites·19 claims
- 3790US8642381B2Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor diePAGAILA REZA A·Filed 2010·Granted Feb 4, 2014·10 cites·24 claims
- 3890US8592975B2Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structurePAGAILA REZA A·Filed 2012·Granted Nov 26, 2013·7 cites·25 claims
- 3990US8592950B2Semiconductor device and method of forming through vias with reflowed conductive materialPAGAILA REZA A·Filed 2010·Granted Nov 26, 2013·8 cites·23 claims
- 4090US8241964B2Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulationPAGAILA REZA A·Filed 2010·Granted Aug 14, 2012·9 cites·25 claims
- 4189US8264080B2Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structurePAGAILA REZA A·Filed 2011·Granted Sep 11, 2012·7 cites·23 claims
- 4288US8563418B2Semiconductor device and method of forming vertically offset bond on trace interconnects on different height tracesPAGAILA REZA A·Filed 2011·Granted Oct 22, 2013·8 cites·24 claims
- 4388US8525344B2Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor diePAGAILA REZA A·Filed 2011·Granted Sep 3, 2013·9 cites·17 claims
- 4487US9484279B2Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor diePAGAILA REZA A·Filed 2010·Granted Nov 1, 2016·8 cites·5 claims
- 4587US8623702B2Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bondingPAGAILA REZA A·Filed 2011·Granted Jan 7, 2014·8 cites·25 claims
- 4687US8435834B2Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSPPAGAILA REZA A·Filed 2010·Granted May 7, 2013·8 cites·15 claims
- 4786US8575769B2Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipationPAGAILA REZA A·Filed 2012·Granted Nov 5, 2013·5 cites·24 claims
- 4885US9177901B2Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillarsPAGAILA REZA A·Filed 2012·Granted Nov 3, 2015·6 cites·31 claims
- 4984US9236352B2Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the diePAGAILA REZA A·Filed 2011·Granted Jan 12, 2016·6 cites·32 claims
- 5084US8227910B2Apparatus for thermally enhanced semiconductor packagePAGAILA REZA A·Filed 2011·Granted Jul 24, 2012·5 cites·22 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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