Assignee
PAGAILA REZA ARGENTY
SG·18 granted patents·2 pending applications·118 citations·filing 2008–2012
Top patents by PatentIndex Score
20 records- 0195US8861221B2Integrated circuit packaging system with a shield and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2010·Granted Oct 14, 2014·23 cites·20 claims
- 0293US9431316B2Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipationPAGAILA REZA ARGENTY·Filed 2010·Granted Aug 30, 2016·17 cites·4 claims
- 0390US8270176B2Exposed interconnect for a package on package systemPAGAILA REZA ARGENTY·Filed 2008·Granted Sep 18, 2012·16 cites·18 claims
- 0486US9093364B2Integrated circuit packaging system with exposed vertical interconnects and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Jul 28, 2015·8 cites·20 claims
- 0586US8815650B2Integrated circuit packaging system with formed under-fill and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Aug 26, 2014·8 cites·20 claims
- 0685US8241955B2Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Aug 14, 2012·6 cites·20 claims
- 0784US8969136B2Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Mar 3, 2015·7 cites·10 claims
- 0881US8304286B2Integrated circuit packaging system with shielded package and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2009·Granted Nov 6, 2012·9 cites·20 claims
- 0975US8406004B2Integrated circuit packaging system and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2008·Granted Mar 26, 2013·5 cites·4 claims
- 1075US8334171B2Package system with a shielded inverted internal stacking module and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2009·Granted Dec 18, 2012·6 cites·20 claims
- 1171US8119447B2Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2009·Granted Feb 21, 2012·4 cites·20 claims
- 1267US8482115B2Integrated circuit packaging system with dual side connection and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2010·Granted Jul 9, 2013·2 cites·7 claims
- 1367US8063477B2Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2008·Granted Nov 22, 2011·3 cites·18 claims
- 1466US9293385B2RDL patterning with package on package systemPAGAILA REZA ARGENTY·Filed 2008·Granted Mar 22, 2016·3 cites·10 claims
- 1564US9059011B2Exposed interconnect for a package on package systemPAGAILA REZA ARGENTY·Filed 2012·Granted Jun 16, 2015·1 cites·20 claims
- 1651US8334169B2Integrated circuit packaging system and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Dec 18, 2012·0 cites·10 claims
- 1750US9029205B2Integrated circuit packaging system having planar interconnect and method for manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted May 12, 2015·0 cites·19 claims
- 1844US8962393B2Integrated circuit packaging system with heat shield and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Granted Feb 24, 2015·0 cites·20 claims
- 1939US2011068478A1Integrated circuit packaging system with package stacking and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2010·Application pending·0 cites
- 2038US2012228768A1Integrated circuit packaging system using b-stage polymer and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2011·Application pending·0 cites
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