Assignee

PAI JENG-HAO

US·1 granted patent·1 citations·filing 2008–2008

Technology mixB01L1 G03F1

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1 record

0154US8748085B2Use of photosensitized Epon epoxy resin 1002F for MEMS and bioMEMS applicationsPAI JENG-HAO·Filed 2008·Granted Jun 10, 2014·1 cites·8 claims

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