Assignee
PARK DONGSAM
KR7 patents
Top patents by PatentIndex Score
US8883561B2Nov 11, 2014
Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
PARK DONGSAM71 citations96
US9087701B2Jul 21, 2015
Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP
PARK DONGSAM10 citations83
US8704365B2Apr 22, 2014
Integrated circuit packaging system having a cavity
PARK DONGSAM13 citations82
US8598034B2Dec 3, 2013
Package-on-package system with through vias and method of manufacture thereof
PARK DONGSAM4 citations61
US8110905B2Feb 7, 2012
Integrated circuit packaging system with leadframe interposer and method of manufacture thereof
PARK DONGSAM4 citations59
US8334601B2Dec 18, 2012
Package-on-package system with through vias and method of manufacture thereof
PARK DONGSAM2 citations58
US8460968B2Jun 11, 2013
Integrated circuit packaging system with post and method of manufacture thereof
PARK DONGSAM0 citations52