Assignee
PARK MYEONG-SOON
KR·1 granted patent·2 pending applications·4 citations·filing 2008–2016
Top patents by PatentIndex Score
3 records- 0164US8193637B2Semiconductor package and multi-chip package using the samePARK MYEONG-SOON·Filed 2008·Granted Jun 5, 2012·4 cites·25 claims
- 0230US2012031953A1Apparatus for bump reflow and methods of forming bumps using the samePARK MYEONG SOON·Filed 2011·Application pending·0 cites
- 0330US2016351472A1Integrated circuit device and method of manufacturing the samePARK MYEONG-SOON·Filed 2016·Application pending·0 cites
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