Assignee
PARK MYUNG GEUN
KR·1 granted patent·1 pending application·4 citations·filing 2008–2008
Top patents by PatentIndex Score
2 records- 0162US8581397B2Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the samePARK MYUNG GEUN·Filed 2008·Granted Nov 12, 2013·4 cites·18 claims
- 0238US2009096079A1Semiconductor package having a warpage resistant substratePARK MYUNG GEUN·Filed 2008·Application pending·0 cites
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