Assignee

PERIAMAN SHANGGAR

MY·2 granted patents·1 pending application·102 citations·filing 2007–2007

Technology mixH10W3

Top patents by PatentIndex Score

3 records

0197US8198716B2Die backside wire bond technology for single or stacked die packagePERIAMAN SHANGGAR·Filed 2007·Granted Jun 12, 2012·92 cites·19 claims
0280US8110930B2Die backside metallization and surface activated bonding for stacked die packagesPERIAMAN SHANGGAR·Filed 2007·Granted Feb 7, 2012·10 cites·19 claims
0343US2008315388A1Vertical controlled side chip connection for 3d processor packagePERIAMAN SHANGGAR·Filed 2007·Application pending·0 cites

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