Assignee

PHAM TIM V

US·2 granted patents·2 citations·filing 2013–2013

Technology mixH01L2 H10D2 H10W2

Top patents by PatentIndex Score

2 records

0162US9318451B2Wirebond recess for stacked diePHAM TIM V·Filed 2013·Granted Apr 19, 2016·2 cites·19 claims
0237US8957510B2Using an integrated circuit die configuration for package height reductionPHAM TIM V·Filed 2013·Granted Feb 17, 2015·0 cites·20 claims

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