Assignee
PHOENIX & CORP
KY·10 granted patents·3 pending applications·4 citations·filing 2017–2020
Top patents by PatentIndex Score
13 records- 0177US10002823B2Packaging substrate and method of fabricating the samePHOENIX & CORP·Filed 2017·Granted Jun 19, 2018·2 cites·5 claims
- 0268US10361160B2Package structure and its fabrication methodPHOENIX & CORP·Filed 2017·Granted Jul 23, 2019·1 cites·12 claims
- 0366US10580739B2Package substrate and associated fabrication method with varying depths for circuit device terminalsPHOENIX & CORP·Filed 2017·Granted Mar 3, 2020·1 cites·14 claims
- 0459US11495379B2Manufacturing method of an integrated driving module with energy conversion functionPHOENIX & CORP·Filed 2020·Granted Nov 8, 2022·0 cites·6 claims
- 0555US11031329B2Method of fabricating packaging substratePHOENIX & CORP·Filed 2018·Granted Jun 8, 2021·0 cites·13 claims
- 0652US10707000B2Integrated driving module with energy conversion function and manufacturing method thereofPHOENIX & CORP·Filed 2019·Granted Jul 7, 2020·0 cites·6 claims
- 0745US11222880B2Package structure for semiconductor device and manufacturing method thereofPHOENIX & CORP·Filed 2019·Granted Jan 11, 2022·0 cites·16 claims
- 0845US10304750B2Package structure and its fabrication methodPHOENIX & CORP·Filed 2018·Granted May 28, 2019·0 cites·10 claims
- 0943US10896882B2Electronic package having heat dissipating element and method for fabricating the samePHOENIX & CORP·Filed 2019·Granted Jan 19, 2021·0 cites·18 claims
- 1043US2020075554A1Electronic package and method for fabricating the samePHOENIX & CORP·Filed 2019·Application pending·0 cites
- 1143US2020305289A1Flexible substrate and method for fabricating the samePHOENIX & CORP·Filed 2019·Application pending·0 cites
- 1240US10269841B1Sensor package and method of manufacturing the samePHOENIX & CORP·Filed 2017·Granted Apr 23, 2019·0 cites·13 claims
- 1338US2019206754A1Electronic package and method of manufacturing the samePHOENIX & CORP·Filed 2018·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →