Assignee
PIETSCH GEORG
DE9 patents
Top patents by PatentIndex Score
US8113913B2Feb 14, 2012
Method for the simultaneous grinding of a plurality of semiconductor wafers
PIETSCH GEORG22 citations89
US9199791B2Dec 1, 2015
Device and method for buffer-storing a multiplicity of wafer-type workpieces
PIETSCH GEORG9 citations83
US9539695B2Jan 10, 2017
Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers
PIETSCH GEORG3 citations69
US8911281B2Dec 16, 2014
Method for trimming the working layers of a double-side grinding apparatus
PIETSCH GEORG1 citations61
US8801500B2Aug 12, 2014
Method for the simultaneous material-removing processing of both sides of at least three semiconductor wafers
PIETSCH GEORG3 citations61
US8974267B2Mar 10, 2015
Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers
PIETSCH GEORG1 citations51
US8398878B2Mar 19, 2013
Methods for producing and processing semiconductor wafers
PIETSCH GEORG0 citations51
US8851958B2Oct 7, 2014
Method for the simultaneous double-side material-removing processing of at least three workpieces
PIETSCH GEORG0 citations40
US8795776B2Aug 5, 2014
Method for providing a respective flat working layer on each of the two working disks of a double-side processing apparatus
PIETSCH GEORG0 citations40