Assignee

PLASMA SIL LLC

US·1 granted patent·22 citations·filing 1998–1998

Technology mixB24B1 H10P1

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1 record

0154US6074947AProcess for improving uniform thickness of semiconductor substrates using plasma assisted chemical etchingPLASMA SIL LLC·Filed 1998·Granted Jun 13, 2000·22 cites·11 claims

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