Assignee
PODDAR ANINDYA
US4 patents
Top patents by PatentIndex Score
US8716830B2May 6, 2014
Thermally efficient integrated circuit package
PODDAR ANINDYA14 citations83
US8674418B2Mar 18, 2014
Method and apparatus for achieving galvanic isolation in package having integral isolation medium
PODDAR ANINDYA14 citations83
US8101470B2Jan 24, 2012
Foil based semiconductor package
PODDAR ANINDYA7 citations82
US8450151B1May 28, 2013
Micro surface mount device packaging
PODDAR ANINDYA13 citations81