Assignee
PONNUSWAMY THOMAS A
US·3 granted patents·71 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0195US8513124B1Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 20, 2013·30 cites·22 claims
- 0293US8703615B1Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafersPONNUSWAMY THOMAS A·Filed 2012·Granted Apr 22, 2014·21 cites·24 claims
- 0391US8500983B2Pulse sequence for plating on thin seed layersPONNUSWAMY THOMAS A·Filed 2010·Granted Aug 6, 2013·20 cites·14 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →