Assignee
PRATT DAVE
US5 patents
Top patents by PatentIndex Score
US9136259B2Sep 15, 2015
Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking
PRATT DAVE21 citations91
US8546919B2Oct 1, 2013
Die stacking with an annular via having a recessed socket
PRATT DAVE3 citations61
US8227343B2Jul 24, 2012
Die stacking with an annular via having a recessed socket
PRATT DAVE1 citations61
US8531046B2Sep 10, 2013
Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
PRATT DAVE1 citations51
US8629060B2Jan 14, 2014
Methods of forming through substrate interconnects
PRATT DAVE0 citations49