Assignee
QIU SHUNAN
CN·3 granted patents·1 pending application·6 citations·filing 2012–2012
Top patents by PatentIndex Score
4 records- 0171US8692387B2Stacked die semiconductor packageQIU SHUNAN·Filed 2012·Granted Apr 8, 2014·5 cites·10 claims
- 0255US8643156B2Lead frame for assembling semiconductor deviceQIU SHUNAN·Filed 2012·Granted Feb 4, 2014·1 cites·18 claims
- 0339US8643153B2Semiconductor device with staggered leadsQIU SHUNAN·Filed 2012·Granted Feb 4, 2014·0 cites·10 claims
- 0433US2014024199A1Semiconductor wafer dicing methodQIU SHUNAN·Filed 2012·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →