Assignee
QMAT INC
US4 patents
Top patents by PatentIndex Score
US10164144B2Dec 25, 2018
Bond and release layer transfer process
QMAT INC7 citations78
US10041187B2Aug 7, 2018
Techniques for forming optoelectronic devices
QMAT INC2 citations68
US9859458B2Jan 2, 2018
Bond and release layer transfer process
QMAT INC4 citations67
US10186630B2Jan 22, 2019
Seed wafer for GaN thickening using gas- or liquid-phase epitaxy
QMAT INC1 citations62