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RAMACHANDRAN VIDHYA

US2 patents

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US8779559B2Jul 15, 2014

Structure and method for strain-relieved TSV

RAMACHANDRAN VIDHYA8 citations82

US9059263B2Jun 16, 2015

Low-K dielectric protection spacer for patterning through substrate vias through a low-K wiring layer

RAMACHANDRAN VIDHYA5 citations71