Assignee
RAMANATHAN LAKSHMI N
US·2 granted patents·1 pending application·3 citations·filing 2005–2010
Top patents by PatentIndex Score
3 records- 0162US8236609B2Packaging an integrated circuit die with backside metallizationRAMANATHAN LAKSHMI N·Filed 2008·Granted Aug 7, 2012·3 cites·16 claims
- 0244US8530346B2Process of forming an electronic device including a conductive stud over a bonding pad regionRAMANATHAN LAKSHMI N·Filed 2010·Granted Sep 10, 2013·0 cites·20 claims
- 0335US2007090156A1Method for forming solder contacts on mounted substratesRAMANATHAN LAKSHMI N·Filed 2005·Application pending·0 cites
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