Assignee
REINMUTH JOCHEN
DE·28 granted patents·5 pending applications·42 citations·filing 2009–2014
Top patents by PatentIndex Score
33 records- 0192US8671757B2Micromechanical componentREINMUTH JOCHEN·Filed 2010·Granted Mar 18, 2014·10 cites·13 claims
- 0279US8778194B2Component having a through-connectionREINMUTH JOCHEN·Filed 2013·Granted Jul 15, 2014·5 cites·10 claims
- 0378US9035432B2Component having through-hole plating, and method for its productionREINMUTH JOCHEN·Filed 2013·Granted May 19, 2015·5 cites·16 claims
- 0475US8299549B2Layer structure for electrical contacting of semiconductor componentsREINMUTH JOCHEN·Filed 2010·Granted Oct 30, 2012·4 cites·5 claims
- 0575US8196474B2Pressure sensorREINMUTH JOCHEN·Filed 2010·Granted Jun 12, 2012·4 cites·5 claims
- 0674US8749250B2Micromechanical component and manufacturing method for a micromechanical componentREINMUTH JOCHEN·Filed 2011·Granted Jun 10, 2014·2 cites·13 claims
- 0773US8850891B2Micromechanical component and manufacturing method for a micromechanical componentREINMUTH JOCHEN·Filed 2011·Granted Oct 7, 2014·2 cites·8 claims
- 0871US9038466B2Micromechanical component and manufacturing method for a micromechanical componentREINMUTH JOCHEN·Filed 2012·Granted May 26, 2015·2 cites·24 claims
- 0971US8756996B2Micromechanical systemREINMUTH JOCHEN·Filed 2011·Granted Jun 24, 2014·2 cites·9 claims
- 1064US8792153B2Micromechanical component, intermediate product produced by a manufacturing method, and manufacturing method for a micromechanical componentREINMUTH JOCHEN·Filed 2012·Granted Jul 29, 2014·1 cites·5 claims
- 1163US8679975B2Method for forming trenches in a semiconductor componentREINMUTH JOCHEN·Filed 2011·Granted Mar 25, 2014·1 cites·25 claims
- 1260US9034757B2Method for manufacturing a component having an electrical through-connectionREINMUTH JOCHEN·Filed 2013·Granted May 19, 2015·1 cites·14 claims
- 1360US8741774B2Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthroughREINMUTH JOCHEN·Filed 2012·Granted Jun 3, 2014·1 cites·12 claims
- 1458US8692339B2Micromechanical component having a rear volumeREINMUTH JOCHEN·Filed 2009·Granted Apr 8, 2014·2 cites·10 claims
- 1549US8659099B2Method for manufacturing a micromechanical structure, and micromechanical structureREINMUTH JOCHEN·Filed 2012·Granted Feb 25, 2014·0 cites·16 claims
- 1649US8436434B2Micromechanical componentREINMUTH JOCHEN·Filed 2011·Granted May 7, 2013·0 cites·5 claims
- 1747US8334534B2Sensor and method for the manufacture thereofREINMUTH JOCHEN·Filed 2009·Granted Dec 18, 2012·0 cites·14 claims
- 1846US8695427B2Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structureREINMUTH JOCHEN·Filed 2011·Granted Apr 15, 2014·0 cites·8 claims
- 1946US8587095B2Method for establishing and closing a trench of a semiconductor componentREINMUTH JOCHEN·Filed 2011·Granted Nov 19, 2013·0 cites·16 claims
- 2046US2014376070A1Micro-electromechanical reflector and method for manufacturing a micro-electromechanical reflectorREINMUTH JOCHEN·Filed 2014·Application pending·0 cites
- 2146US2015054101A1Micromechanical component and method for manufacturing a micromechanical componentREINMUTH JOCHEN·Filed 2014·Application pending·0 cites
- 2245US8752431B2Acceleration sensor method for operating an acceleration sensorREINMUTH JOCHEN·Filed 2009·Granted Jun 17, 2014·0 cites·9 claims
- 2345US8563344B2Method for producing MEMS structures, and MEMS structureREINMUTH JOCHEN·Filed 2011·Granted Oct 22, 2013·0 cites·5 claims
- 2444US9114978B2Method for manufacturing a component having an electrical through-connectionREINMUTH JOCHEN·Filed 2013·Granted Aug 25, 2015·0 cites·15 claims
- 2543US9136169B2Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthroughREINMUTH JOCHEN·Filed 2011·Granted Sep 15, 2015·0 cites·16 claims
- 2642US8481401B2Component having a through-contactREINMUTH JOCHEN·Filed 2011·Granted Jul 9, 2013·0 cites·10 claims
- 2741US9159619B2Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthroughREINMUTH JOCHEN·Filed 2013·Granted Oct 13, 2015·0 cites·10 claims
- 2840US8607447B2Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areasREINMUTH JOCHEN·Filed 2011·Granted Dec 17, 2013·0 cites·10 claims
- 2939US9309107B2Micromechanical system and corresponding manufacturing methodREINMUTH JOCHEN·Filed 2012·Granted Apr 12, 2016·0 cites·7 claims
- 3039US2013209672A1Component having a through-connectionREINMUTH JOCHEN·Filed 2013·Application pending·0 cites
- 3138US9344806B2Component having a micro-mechanical microphone structure and method for producing the componentREINMUTH JOCHEN·Filed 2010·Granted May 17, 2016·0 cites·12 claims
- 3237US2010327883A1Inductive delta c evaluation for pressure sensorsREINMUTH JOCHEN·Filed 2010·Application pending·0 cites
- 3333US2011068419A1Micromechanical systemREINMUTH JOCHEN·Filed 2010·Application pending·0 cites
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