Assignee
RIEDL EDMUND
DE·3 granted patents·5 citations·filing 2008–2008
Top patents by PatentIndex Score
3 records- 0163US8410586B2Semiconductor package and method of assembling a semiconductor packageRIEDL EDMUND·Filed 2008·Granted Apr 2, 2013·5 cites·24 claims
- 0253US8147621B2Method for producing a metal article intended for at least partially coating with a substanceRIEDL EDMUND·Filed 2008·Granted Apr 3, 2012·0 cites·18 claims
- 0344US8603864B2Method of fabricating a semiconductor deviceRIEDL EDMUND·Filed 2008·Granted Dec 10, 2013·0 cites·5 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →