Assignee

RIES MICHAEL JOHN

US·1 granted patent·11 citations·filing 2012–2012

Technology mixB23B1 B32B1 C09J1 H01L1 H10P1 H10W1

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0186US8845859B2Systems and methods for cleaving a bonded wafer pairRIES MICHAEL JOHN·Filed 2012·Granted Sep 30, 2014·11 cites·21 claims

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