Assignee

SAHASRABUDHE KAPIL HERAMB

US·1 granted patent·1 pending application·4 citations·filing 2009–2011

Technology mixH10W2

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2 records

0162US8102038B2Semiconductor chip attach configuration having improved thermal characteristicsSAHASRABUDHE KAPIL HERAMB·Filed 2009·Granted Jan 24, 2012·4 cites·21 claims
0237US2012094441A1Semiconductor Chip Attach Configuration Having Improved Thermal CharacteristicsSAHASRABUDHE KAPIL HERAMB·Filed 2011·Application pending·0 cites

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