Assignee
SAINT-PATRICE DAMIEN
FR·2 granted patents·2 citations·filing 2010–2011
Top patents by PatentIndex Score
2 records- 0163US8470184B2Method for making a cavity in the thickness of a substrate which may form a site for receiving a componentSAINT-PATRICE DAMIEN·Filed 2010·Granted Jun 25, 2013·2 cites·15 claims
- 0236US8482130B2Interconnect structure comprising blind vias intended to be metalizedSAINT-PATRICE DAMIEN·Filed 2011·Granted Jul 9, 2013·0 cites·11 claims
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