Assignee
SAITO HIDEAKI
JP·3 granted patents·3 pending applications·113 citations·filing 2006–2012
Top patents by PatentIndex Score
6 records- 0197US8149906B2Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speedSAITO HIDEAKI·Filed 2008·Granted Apr 3, 2012·106 cites·25 claims
- 0272US8106378B2Semiconductor quantum dot deviceSAITO HIDEAKI·Filed 2006·Granted Jan 31, 2012·3 cites·15 claims
- 0370US8315331B2Transmission method, transmission circuit and transmission systemSAITO HIDEAKI·Filed 2009·Granted Nov 20, 2012·4 cites·2 claims
- 0443US2013098656A1Polyimide resin varnish, and insulated wire, electrical coil, and motor using sameSAITO HIDEAKI·Filed 2012·Application pending·0 cites
- 0542US2013153262A1Polyester imide resin based varnish for low-permittivity coating filmSAITO HIDEAKI·Filed 2011·Application pending·0 cites
- 0630US2012118616A1Negative photosensitive resin composition, polyimide resin film using same, and flexible printed circuit boardSAITO HIDEAKI·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →