Assignee
SAJI TETSUO
JP·3 granted patents·28 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0196US8483104B1High-frequency circuit moduleSAJI TETSUO·Filed 2012·Granted Jul 9, 2013·25 cites·13 claims
- 0274US8735732B2Multilayer substrateSAJI TETSUO·Filed 2011·Granted May 27, 2014·3 cites·22 claims
- 0340US9041485B2High frequency electronic componentSAJI TETSUO·Filed 2012·Granted May 26, 2015·0 cites·12 claims
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